0.8 mm Bhodhi kune Bhodhi yekubatanidza - 11.7mm Height Mukadzi
Kaviri Row Bhodhi Kubhodhi Chibatanidza
● Zvigadzirwa Zvinotsanangurwa
• Kugumiswa kweSMT
• Dual row connector
• Data mitengo inosvika 12 Gbit/s
• Nzvimbo mapegi ekunyatsoiswa kwebhodhi
• Yakazara otomatiki bhodhi musangano
● Dimensional Drawings
Kuraira Ruzivo
| Aihwa.of Pini | Packaging | Chikamu Numeri |
| 30 | Tape uye reel | ZIV30S4E0B |
| 40 | Tape uye reel | ZIV40S4E0B |
| 50 | Tape uye reel | ZIV50S4E0B |
| 60 | Tape uye reel | ZIV60S4E0B |
| 80 | Tape uye reel | ZIV80S4E0B |
| 100 | Tape uye reel | ZIVA0S4E0B |
| 120 | Tape uye reel | ZIVC0S4E0B |
| 140 | Tape uye reel | ZIVE0S4E0B |
● Pfungwa
Iyo 0.8mm bhodhi kuenda kubhodhi yekubatanidza yePlastron igadziriso inochinjika yakagadzirirwa kukurumidza uye yakakwirira-density data transmission parallel board-to-board connector system ine 16 PCB stack urefu mu9 saizi kusvika 140 nzvimbo.
• Housing uye terminal profile inovimbisa data kutapurirana kukurumidza kusvika 12Gb/s
• Kumisikidza kuenderana kwakatwasuka
• 30 kusvika 140 nzvimbo saizi mu20 chinzvimbo increments
● Ruzivo Rwounyanzvi
Tsanangudzo
Chiratidzo chekuvimbika
Durability: 100 mating cycles
Simba rekubatanidza: 150gf max./ Bata vaviri
Simba rekusabatana: 10gf min./ Bata vaviri
Kushanda tembiricha: -40 ℃ ~ 105 ℃
Hupenyu hwekushisa kwepamusoro: 105 ± 2 ℃, 250 maawa
Insulation kuramba: 100 MΩ
Yakatemerwa ikozvino: 0.5 ~ 1.5A / papini
Bata kuramba: 50mΩ
Rated voltage: 50V ~ 100V AC / DC
Nguva dzose tembiricha uye humidity: Hukama humidity 90 ~ 95% 96 maawa
Yakasiyana impedance renji: 80~110Ω 50ps (10~90%)
Kuisa kurasikirwa: ＜1.5dB 6GHz/ 12Gbps
Kudzoka kurasikirwa: ＜ 10dB 6GHz/ 12Gbps
Crosstalk: ≤ -26 dB 50ps (10~90%)
Mukadzi End Material
● Fully Automatic Gungano Uye Reflow Soldering
● Zvinhu
